发明名称 Composition for forming porous film and method for forming the same, porous film and method for forming the same, interlevel insulator film, and semiconductor device
摘要 Provided is a composition formed by hydrolysis and condensation composition of the alkoxysilane, the composition comprising a reduced amount of metallic and halogen impurities and being applicable as electronic material. Also provided is an insulating film having low dielectric constant produced by applying the composition and sintering it. More specifically, a method for manufacturing a composition for forming a film, comprising a step of hydrolysis and condensation of alkoxysilane or a partial hydrolysis product of the alkoxysilane in an organic solvent in the presence of trialkylmethylammonium hydroxide as catalyst, wherein the alkoxysilane is selected from the groups consisting of compounds represented by formulae (1) to (4) below, and the trialkylmethylammonium hydroxide is represented by formula (5) below. Provided are a composition for forming a film obtained by the method, and a low dielectric constant film having low metallic and halogen impurities, the film produced by applying the composition for forming a film on a substrate and sintering it.
申请公布号 US2004180554(A1) 申请公布日期 2004.09.16
申请号 US20040796656 申请日期 2004.03.09
申请人 SHIN-ETSU CHEMICAL CO., LTD.;MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HAMADA YOSHITAKA;YAGIHASHI FUJIO;NAKAGAWA HIDEO;SASAGO MASARU
分类号 B05D7/24;C01B33/12;C08G77/08;C08G77/18;C09D183/00;H01L21/312;H01L21/316;H01L21/768;(IPC1-7):H01L21/31 主分类号 B05D7/24
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