METHOD FOR MANUFACTURING MEMORY MODULE FOR MEMORY EXTENSION CAPABLE OF INCREASING PRODUCTIVITY

摘要

PURPOSE: A method for manufacturing a memory module for memory extension is provided to increase productivity by electrically connecting memory modules using thermocompression bonding. CONSTITUTION: Electronic components(150) are mounted on two substrates(100,200). Each of the substrates is a hard printed circuit board. The substrates are formed on a plane upon being separated with a predetermined distance. A flexible printed circuit(300) is provided between the substrates. The flexible printed circuit and the substrates are electrically connected through thermocompression bonding. The flexible printed circuit functions an internal circuit layer as well as a connector for the substrates. A portion(350) of the flexible printed circuit is cut since it does not provide an internal circuit layer function.