| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad the polishing characteristics of which are little changed while the pad is stored and can be used for an extremely long time. <P>SOLUTION: The surface of the polishing layer of the polishing pad is covered with a material having a transmissivity of ≤50% to light rays in the whole wavelength region of 300-380 nm. A resin sheet-like material is preferably used as the material of the polishing pad. The polishing pad can be utilized suitably for a step of mechanically flattening the surface of an insulating layer or metal wiring formed on a semiconductor substrate composed of silicon etc. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
