| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable high productivity electronic component in which a lid can be fixed rigidly to a case even when the size or the profile is reduced, and degradation of characteristics due to inflow of an adhesive can be prevented effectively without requiring management of the quantity of the adhesive being ejected. SOLUTION: A columnar protrusion 8 or a planar protrusion 51 of the same material as that of the case 2, i.e. thermoplastic resin, is softened/deformed and compressed against the upper surface of the lid 5. Under that state, it is cooled/set thus securing the lid 5 rigidly to the case 2. The lid 5 is formed of resin having a thermal deformation temperature higher than that of the case 2 and the columnar protrusion 8. COPYRIGHT: (C)2004,JPO&NCIPI
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