| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board and its manufacturing method capable of suppressing the positional variation of an electrode pad due to the burning of a ceramic green sheet and effectively suppressing the generation of deformation or cracks caused by the inner stress. SOLUTION: A ceramic circuit board 10 is constituted by forming an annular 1st insulating layer 4 arranged along the outer periphery of a base body 1, and a 2nd insulating layer 5 arranged inside the 1st insulating layer 4 with a prescribed interval on one main surface of the base body 1, arranging an electrode pad 2 on one main surface of the base body 1 located between the 1st insulating layer 4 and the 2nd insulating layer 5 and coating the 1st insulating layer 4 and the 2nd insulating layer 5 with an overcoat layer 3 having an aperture on the electrode pad 2. The 1st and 2nd insulating layers 4, 5 consist of a 2nd inorganic component which starts sintering at a temperature lower than that of a 1st inorganic component forming the base body 1, and a 3rd inorganic component forming the overcoat layer 3. COPYRIGHT: (C)2004,JPO&NCIPI
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