| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem in a package for an optical semiconductor element that since the wiring conductor and the metal terminal of an insulating substrate are bonded perpendicularly, high frequency signals of 10 GHz or above interfere and increase the reflection loss extremely thus causing significant deterioration of the optical semiconductor element due to the transmission length. SOLUTION: The package for an optical semiconductor element comprises a metal substrate 1 having a mounting part 1a of the optical semiconductor element S in the center of the upper surface and two through holes 1b formed from the upper surface to the lower surface in the vicinity of the mounting part 1a, two metal terminals 3 inserted into respective through holes 1b and secured through a sealing material 2 such that the end part on the lower surface side projects from the through hole 1b and the electrode of the optical semiconductor element S is connected electrically with the end part on the upper surface side, and a square planar insulating substrate 5 having two linear wiring conductors 4 fixed in parallel to the opposite major surfaces from one side to the opposite side and bonded in parallel to the part of two metallic terminals 3 projecting to the lower surface side such that the opposite major surfaces are held between. COPYRIGHT: (C)2004,JPO&NCIPI
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