发明名称 |
METHOD FOR MANUFACTURING INDUCTANCE ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for easily manufacturing a small and light inductance element by saving a space without winding a wire or forming a conductive pattern on a printed wiring board. SOLUTION: A lower side lead frame 6 where a plurality of patterns 5 are radially formed is overlapped with an upper side lead frame 7 where a plurality of patterns 15 are radially formed. The pattern 15 bonds one end (one end part 5A) on the center side of the pattern 5 and the other end (bonding part 8) on the outer peripheral side of the other pattern adjacent to the pattern 5. The patterns 5 and 15 form a winding part 1 in a toroidal shape by cutting it near the outer side of the other end of the pattern 5. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004259944(A) |
申请公布日期 |
2004.09.16 |
申请号 |
JP20030049166 |
申请日期 |
2003.02.26 |
申请人 |
DENSEI LAMBDA KK;OMURON TAKEO CO LTD |
发明人 |
HAYAFUKU TOSHIAKI;TAKAHASHI HIROAKI;SUGIMOTO SHUICHI |
分类号 |
H01F41/04;H01F17/06;(IPC1-7):H01F41/04 |
主分类号 |
H01F41/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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