| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for containing a semiconductor element and a semiconductor device which hermetically accommodates the semiconductor element and can sufficiently dissipate heat generated from the semiconductor element. SOLUTION: The package for containing a semiconductor element comprises a square plane-shaped metal substrate 1 in which a mounting part 1a for mounting a semiconductor element 4 is formed on an upper main surface; a square metal frame member 2 whose outer diameter is smaller than the substrate 1 and which is attached on periphery of the upper main surface of the substrate 1 so as to surround the mounting part 1a, and has an attaching part 2a of I/O terminals 3 which are formed on one side section and the other side section which faces the one side section by notching the respective lower sides of the side sections; and the ceramics I/O terminals 3 which are engaged with the attaching part 2a, and have metallized wiring layers which electrically connect the inside and the outside of the frame member 2. In the substrate 1, a plurality of trenches A which run along interior and exterior of the frame member 2 and side sections of the I/O terminals 3 are arranged inside and outside the frame member 2 of the upper main surface, over all periphery of the frame member 2. COPYRIGHT: (C)2004,JPO&NCIPI
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