| 摘要 |
PROBLEM TO BE SOLVED: To provide a high quality and high precision pattern wiring board or a device substrate. SOLUTION: A liquid drop ejector 1 imparts a plurality of drops of a solution containing microparticles to a substrate 14 by means of an ejection head 11 and forms pattern wiring or a device by evaporating volatile components in the liquid drop. Surface roughness on the patterning surface of the substrate is set rougher than sizes of microparticles and surface roughness on the rare surface of the substrate is set rougher than that of the patterning surface but not rougher than that of the substrate holding surface of the liquid drop ejecting manufacturing device. Assuming the size of microparticles is Dp and the diameter of the ejection opening is Do, a following relation is satisfied; 0.0001≤Dp/Do≤0.01. The ejection head ejects a liquid drop by a reaction force resulting from mechanical displacement wherein a drop under flying is a substantially round drop immediately before adhering to the substrate surface or a columnar drop elongated within three times of its diameter in the flying direction and a plurality of microdrops do not follow the flying drop. COPYRIGHT: (C)2004,JPO&NCIPI
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