发明名称 METHOD FOR OPTIMIZING FILM FORMING TIME AND OPTIMIZING SYSTEM OF FILM FORMING TIME
摘要 PROBLEM TO BE SOLVED: To improve the uniformity of the time to process the thickness of an oxide film by calculating an optimum oxidation processing time in a process managing system from the oxidizing time, film thickness data and atmospheric pressure data at previous processing time in the atmospheric pressure data at a process starting time, a film thickness value aimed at its process and the same oxidizing process Job when a thermal oxidation process is started. SOLUTION: This optimizing system of the film forming time includes, as shown in Fig., a step managing system (HOST computer, host computer) 10 for managing a thermal oxidation process, etc., a unit (barometer) 20 having a barometer, a thermal oxidation processing unit 30, and a film thickness measuring unit 40. The HOST computer 10 is connected to the barometer 20, the thermal oxidation processing unit 30 and the film thickness measuring unit 40 via a network to transmit and receive data to and from the respective units. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004259757(A) 申请公布日期 2004.09.16
申请号 JP20030046029 申请日期 2003.02.24
申请人 SEIKO EPSON CORP 发明人 TADANO AKIRA;INOUE YUSUKE;YOKOYAMA ISAO
分类号 H01L21/31;H01L21/027;H01L21/316;H01L21/66;(IPC1-7):H01L21/316 主分类号 H01L21/31
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