| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing the warp of a board and the crack and of an external terminal. SOLUTION: The semiconductor device comprises a semiconductor chip 103, a first chip supporting board 101 for supporting the semiconductor chip 103, a second chip supporting board 104 which is provided with a first region where the first chip supporting board 101 is formed and a second region on its front surface, a first wiring layer 106 formed on the second region of the second chip supporting board 104, and a sealing material 110 which seals up the semiconductor chip 103. In the semiconductor device, the coefficient of thermal expansion of the first chip supporting board 101 is intermediate between those of the semiconductor chip 103 and the second chip supporting board 104. COPYRIGHT: (C)2004,JPO&NCIPI
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