发明名称 COOLING STRUCTURE OF SPINDLE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a spindle device cooling structure in which the entire device can be miniaturized while maintaining the rigidity of a spindle, and a bearing member can be easily fitted into a cover. SOLUTION: The spindle device cooling structure is provided with a bearing member to support a spindle to be rotated, a housing to store the bearing member, a cooling medium groove which is formed in an exposed manner to an outer surface of the housing to allow cooling medium to pass, and a cover which covers an outer surrounding of the housing, and closes the cooling medium groove to form a cooling medium passage. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004257499(A) 申请公布日期 2004.09.16
申请号 JP20030050209 申请日期 2003.02.27
申请人 PENTAX CORP 发明人 SAKAI YUJI
分类号 F16C37/00;D01H7/20;F16C32/06;(IPC1-7):F16C37/00 主分类号 F16C37/00
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