| 摘要 |
<p>The present invention provides an improved method and an apparatus for removing contaminants from a surface of a substrate. The method according to the present invention comprises the steps of moving a substrate relatively to a plasma generating source or a plasma generating source, preheating selectively the surface to be cleaned among surfaces of the substrate with a radiant heat generated from a radiant heat source and reflected by a reflecting panel, converting a processing gas, which is introduced into a plasma generating space formed between the two electrodes insulated with a dielectric, into plasma using an alternating current voltage impressed from an alternating current supply, and removing contaminants formed on the surface by contacting the preheated surface of the substrate to be cleaned with the plasma. The method could improve preheating efficiency by preheating the surface to be cleaned selectively and prevent damage to the circuit, which is formed inside the substrate, by thermal expansion. Moreover, the processing efficiency could be remarkably improved by selectively preheating the surface to be cleaned with a radiant heat from a radiant heat source.</p> |
