SEMICONDUCTOR DEVICE

摘要

A first wiring layer overlying a semiconductor substrate has the arrangement of adjacent wirings in the order of first wirings and first shield wirings. A second wiring layer overlying the semiconductor substrate has the arrangement of adjacent wirings in the order of second shield wirings and second wirings to correspond to the respective first wirings and first shield wirings in the first wiring layer. Thus, the capacitance between adjacent wirings is reduced as well as the noise between adjacent wirings. Further, power consumption is reduced without a decrease in the action speed of a signal.