发明名称 Component mounting inspection method and apparatus
摘要 Inspection a is executed between a step B of mounting a chip component by a high-speed mounter and a step C of mounting an odd-shaped component by an odd-shape mounter. The inspection a executes not only mounted component inspection for determining a mounted state of a chip component mounted in the preceding step but also component fly inspection for determining whether a chip component is flown to a position where a odd-shaped component is mounted in the next step C. It is possible to execute the component fly inspection in accordance with a condition corresponding to the situation of an actual spot such as a case in which it is detected that a component is missing in mounted component inspection or a case in which the replacement date of an attracting nozzle in a high-speed mounter is approaching.
申请公布号 EP1452882(A3) 申请公布日期 2004.09.15
申请号 EP20040004244 申请日期 2004.02.25
申请人 OMRON CORPORATION 发明人 MURAKAMI, KIYOSHI
分类号 H05K13/08;G01N21/956;G01R31/28;G01R31/309 主分类号 H05K13/08
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