发明名称 A METHOD OF IMPROVING SURFACE PLANARITY PRIOR TO MRAM BIT MATERIAL DEPOSITION
摘要 <p>The present invention provides a method of fabricating a portion of a memory cell, the method comprising providing a first conductor in a trench which is provided in an insulating layer and flattening an upper surface of the insulating layer and the first conductor, forming a material layer over the flattened upper surface of the insulating layer and the first conductor and flattening an upper portion of the material layer while leaving intact a lower portion of the material layer over the insulating layer and the first conductor.</p>
申请公布号 EP1456873(A1) 申请公布日期 2004.09.15
申请号 EP20020795903 申请日期 2002.12.18
申请人 MICRON TECHNOLOGY, INC. 发明人 YATES, DONALD, L.;DREWES, JOEL, A.
分类号 H01L21/302;H01L21/3205;G11C5/02;G11C11/00;G11C11/02;G11C11/15;H01L21/203;H01L21/768;H01L21/8246;H01L27/105;H01L27/22;H01L43/08;(IPC1-7):H01L21/302 主分类号 H01L21/302
代理机构 代理人
主权项
地址