发明名称 |
Field plated schottky diode and method of fabrication therefor |
摘要 |
A Schottky diode is fabricated by a sequence of fabrication by a sequence of fabrication steps. An active region of a semiconductor substrate is defined in which a Schottky diode is fabricated. At least first and second layers of insulating material are applied over the active area. A first layer of insulating material, having a first etching rate, is applied over the active area. A second layer of insulating material having a second, greater, etch rate is applied over the first layer of insulating material to a thickness that is about twice the thickness of the first layer of insulating material. The insulating material is patterned and a window is etched through the layers of insulating material to the semiconductor substrate. Metal is applied and unwanted metal is etched away leaving metal in the window forming a Schottky contact therein. One or more barrier layers may be employed.
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申请公布号 |
US6790753(B2) |
申请公布日期 |
2004.09.14 |
申请号 |
US20030696136 |
申请日期 |
2003.10.29 |
申请人 |
AGERE SYSTEMS INC |
发明人 |
DESKO JOHN CHARLES;EVANS MICHAEL J;HSIEH CHUNG-MING;HSIEH TZU-YEN;JONES BAILEY R;KRUTSICK THOMAS J.;SIKET, JR. JOHN MICHAEL;THOMPSON BRIAN ERIC;WALLACE STEVEN W. |
分类号 |
H01L29/06;H01L29/40;H01L29/872;(IPC1-7):H01L21/28;H01L21/44 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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地址 |
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