发明名称 |
Circuit board and production method therefor |
摘要 |
A lead frame of a circuit board is punched in a direction opposite to a heat sink plate. Even if burrs are produced due to the punching, the burrs do not penetrate a sheet or short-circuit to the heat sink plate. A resist film tightly contacts on the periphery of a land of the lead frame of the circuit board, and a plated layer tightly contacts on the land. This prevents electronic components from defective mounting on the land.
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申请公布号 |
US6791034(B2) |
申请公布日期 |
2004.09.14 |
申请号 |
US20020238688 |
申请日期 |
2002.09.10 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SUZUMURA MASAKI;OKADA KAZUO;HIRANO KOICHI;OKAWA TAKAAKI;TANAKA SHINYA |
分类号 |
H01L23/498;H01L23/538;H05K3/00;H05K3/04;H05K3/20;H05K3/28;(IPC1-7):H05K1/00 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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