发明名称 Sample assembly for thermoelectric analyzer
摘要 In a sample assembly for a thermoelectric analyzer, typically TSC (Thermally Stimulated Current) analyzer, a sample is fixed to an electrically-insulating substrate via an adhesive layer. The material of the adhesive layer is indium or gold-tin alloy. The substrate has a pair of junction electrode layers formed thereon and a pair of electrode layers formed on the same plane of the sample. One of the electrode layers is connected with one of the junction electrode layers by electrically-conductive wire, while the other of the electrode layers is connected with the other of the junction electrode layers by another electrically-conductive wire. The substrate is made of preferably made of a highly electrically-insulating and highly thermally-conductive material which may be, for example, aluminum nitride (AlN), boron nitride (BN), beryllium oxide (BeO) or aluminum oxide (Al2O3). The sample may preferably be a compound semiconductor such as GaAs.
申请公布号 US6791335(B2) 申请公布日期 2004.09.14
申请号 US20010941879 申请日期 2001.08.29
申请人 RIGAKU CORPORATION;MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 HIRAYAMA TAISEI;INAMI MASANOBU;MATSUO SHUICHI;ITO KOICHIRO;HATTORI RYO;YAMAMOTO YOSHITUGU;NOTANI YOSHIHIRO;MIYAKUNI SHINICHI
分类号 G01R27/26;G01N1/28;G01N25/00;G01N25/48;(IPC1-7):G01N25/00 主分类号 G01R27/26
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