发明名称 |
Testing of BGA and other CSP packages using probing techniques |
摘要 |
A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.
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申请公布号 |
US6791346(B2) |
申请公布日期 |
2004.09.14 |
申请号 |
US20020140573 |
申请日期 |
2002.05.08 |
申请人 |
ST. ASSEMBLY TEST SERVICES PTE LTD |
发明人 |
MEHTA RAJIV;YAP LIOP-JIN;CAMENFORTE RAYMUNDO M.;TAN CHEE-KEONG |
分类号 |
G01R31/28;(IPC1-7):G01R31/02 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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