发明名称 Self-aligned dual-gate transistor device and method of forming self-aligned dual-gate transistor device
摘要 Embodiments in accordance with the present invention provide methods of forming a dual gated semiconductor-on-insulator (SOI) device. Such methods encompass forming a first transistor structure operatively adjacent a first side of the semiconductor layer of an SOI substrate. Insulator layer material is removed from the second side of the semiconductor layer, between the source/drain contact structures of the first transistor structure and a second transistor structure there formed operatively adjacent the second side of the semiconductor layer and aligned to the first transistor structure.
申请公布号 US6790732(B2) 申请公布日期 2004.09.14
申请号 US20030455975 申请日期 2003.06.06
申请人 MICRON TECHNOLOGY, INC. 发明人 ZAHURAK JOHN K.;KEETH BRENT;DENNISON CHARLES H.
分类号 H01L21/336;H01L21/84;H01L27/12;H01L29/786;(IPC1-7):H01L21/336 主分类号 H01L21/336
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