发明名称 |
Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects |
摘要 |
Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material formed thereon in a polishing apparatus having one or more rotational carrier heads and one or more rotatable platens, wherein the carrier head comprises a retaining ring and a membrane for securing a substrate and the platen has a polishing article disposed thereon, contacting the substrate surface and the polishing article to each other at a retaining ring contact pressure of about 0.4 psi or greater than a membrane pressure, and polishing the substrate to remove conductive material.
|
申请公布号 |
US6790768(B2) |
申请公布日期 |
2004.09.14 |
申请号 |
US20010025144 |
申请日期 |
2001.12.18 |
申请人 |
APPLIED MATERIALS INC. |
发明人 |
MOON YONGSIK;MAI DAVID;WIJEKOON KAPILA;BAJAJ RAJEEV;SURANA RAHUL;HU YONGQI;KAUSHAL TONY S.;LI SHIJIAN;LI JUI-LUNG;WANG SHI-PING;LAM GARY;REDEKER FRED C. |
分类号 |
B24B1/00;B24B5/00;B24B29/00;B24B37/04;C23F1/00;H01L21/306;H01L21/321;H01L21/461;H01L21/4763;H01L21/768;(IPC1-7):B24B1/00 |
主分类号 |
B24B1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|