| 摘要 |
PURPOSE: An apparatus for cooling semiconductor exposure equipment is provided to guarantee a smooth operation of the semiconductor exposure equipment by efficiently reducing a temperature increase caused by heat generated in operating the semiconductor exposure equipment. CONSTITUTION: A flow path(100,200) for flowing coolant is formed in a predetermined cooling plate(90). One end part of the flow path is used as an inlet(100a,200a) of the coolant, and the other end part of the flow path is used as an outlet(100b,200b) of the coolant. The flow path circulates a predetermined portion of the cooling plate. Two of the flow paths are prepared.
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