TAB ATTACHING METHOD USING SUPERSONIC WAVES WELDING IN SEMICONDUCTOR MODULE PROCESS

摘要

PURPOSE: A TAB(tape automated bonding) attaching method using supersonic waves welding in a semiconductor module process is provided to reduce fabricating cost and improve productivity by attaching a TAB by a supersonic welding method without using an ACF(anisotropic conductive film). CONSTITUTION: A TAB electrode(12) and a glass/PCB(printed circuit board) electrode(14) are aligned. Predetermined clamping pressure is formed on the contact surface of the TAB electrode and the glass/PCB electrode while the TAB electrode is connected to a vibrator of a supersonic vibrating system. The vibrator is transversely supersonic-vibrated until the oxide layer of an electrode contact surface is eliminated and both electrodes are merged to be electrically conducted.