Semiconductor device with gel resin vibration limiting member

摘要

A semiconductor device, in which the air within a gel resin can be efficiently and well purged, comprising a casing, a semiconductor device electrically connected by bonding wires and a gel resin filled in the casing and serves for insulation covering of the semiconductor device and the bonding wire. The device further comprises a board-shaped vibration damper in contact with the gel resin and is provided with a plurality of perforations each having an air inlet and an air outlet for the purpose of air extraction during the filling of the gel resin. The sectional area of the perforations is tapered and larger at the inlet than at the outlet, thus causing the perforations to have the form of a substantially conical trapezoid as a whole.