PATTERN FOR MEASURING OVERLAY ACCURACY OF SEMICONDUCTOR DEVICE HAVING A PROTRUDING OUTER BOX AND A RECTANGULAR INNER BOX

摘要

PURPOSE: A pattern for measuring overlay accuracy of a semiconductor device is provided to restrict movement of an outer box and an inner box due to movement of a lower layer by increasing a contact area among an outer box and an inner box and a substrate. CONSTITUTION: A pattern for measuring overlay accuracy of a semiconductor device is formed with an outer box and an inner box. The outer box(22) is formed in a previous layer. The inner box(24) is formed on a present layer. The outer box is formed with a shape of a rectangular frame having edges including projections. A contact area between a lower layer and the outer box is increased by the edges including projections. The inner box is installed within the outer box and is formed with a rectangular shape.