ELECTRONIC COMPONENT FOR ADHERING MULTIPLE ELECTRODES FORMED BY TEMPORARILY CURING ANISOTROPIC CONDUCTIVE ADHESIVE AGENT AND INSULATIVE ADHESIVE AGENT, AND MOUNTING METHOD THEREOF

摘要

PURPOSE: An electronic component and a mounting method thereof are provided to achieve improved work efficiency by simplifying adhering processes of electronic component to circuit board, and prevent defects by enhancing adhering force of electronic component. CONSTITUTION: A plurality of electrodes and spaces are arranged in a desired place of a base(12) having an insulating property. An anisotropic conductive adhesive agent(S) is deposited on the corresponding electrode. An insulative adhesive agent(M) is deposited on the corresponding space, wherein the insulative adhesive agent has a curing condition almost the same as that of the anisotropic conductive adhesive agent. The insulative adhesive agent and the anisotropic conductive adhesive agent are temporarily cured.