ELECTRONIC PART MANUFACTURING METHOD AND BASE SHEET

摘要

An electronic part manufacturing method, comprising the steps of sticking an insulation sheet with resin on a conductor part formed of a wiring pattern and a columnar conductor from the upper side and covering the conductor part with resin by pressurizing and heating the insulation sheet having the columnar conductor used as a stopper to form a layer with a specified thickness by using the height of the columnar conductor as a reference. In the manufacturing method, a projected part is provided on the outer side of a part formation area to use as a base sheet, the amount of the resin required for the layer is calculated by using, as a guide, the occupancy rate of the conductor part in an area including the projected part, and the thickness of the insulation sheet is set according to the amount of the resin.