| 发明名称 |
CMP METHOD FOR NOBLE METALS |
| 摘要 |
The invention provides a method of polishing a substrate comprising a noble metal comprising (i) contacting the substrate with a CMP system and (ii) abrading at least a portion of the substrate to polish the substrate. The CMP system comprises an abrasive and/or polishing pad, a liquid carrier, and a sulfonic acid compound. |
| 申请公布号 |
WO2004076574(A2) |
申请公布日期 |
2004.09.10 |
| 申请号 |
WO2004IB00993 |
申请日期 |
2004.02.19 |
| 申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
DE REGE THESAURO, FRANCESCO;BRUSIC, VLASTA;BAYER, BENJAMIN, P. |
| 分类号 |
B24B37/04;C09G1/02;C09K3/14;C23F3/00;C23F3/06;H01L21/02;H01L21/321 |
主分类号 |
B24B37/04 |
| 代理机构 |
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