ELECTRON-BEAM IC TESTER

摘要

An electron beam head (11) is exposed downward from a round hole (22) bored in a support bed (20) supporting thereon an electron beam irradiation appa­ratus (10), and a bottomed cylindrical member (60) is disposed on a performance board (25) fitted to a test head (40) below the head (11) in such a way that its hollow opposes the electron beam head (11). A ring-­like wiring board (53) is placed on the upper end of the bottomed cylindrical member (60) and a ring-like hermetic connection mechanism (70) is so disposed as to sandwich the wiring board (53) with the cylindrical member (60). The ring-like hermetic connection mechanism is connected air-tight to the support bed and holds the space facing the electron beam head and the hollow of the bottomed cylindrical member (60). A sample support plate (51), the peripheral portion of which is supported, is disposed inside the ring-like hermetic connection mechanism, and an IC socket (52) for a test IC is fitted to the sample support plate (51). A plurality of flexible contacts (53A) are implanted to a portion of the ring-like wiring board (53) positioned inside the bottomed cylindrical member (60) and are connected to wirings of the sample sup­port plate (51). The flexible contacts (53A) are extended outside the bottomed cylindrical member (60) by the wirings of the ring-like wiring board (53) and are connected to the wirings of the performance board (25) through a coaxial cable (53C).