CERAMIC CIRCUIT BOARD AND CONDUCTIVE PASTE USED THEREFOR

摘要

A low-cost ceramic circuit board having high junction reliability in a joined portion between a planar wiring conductor and/or a via conductor and a resistive element is disclosed. A conductive paste used for such a ceramic circuit board is also disclosed. A ceramic circuit board (10) comprises a resistive element (14) connected to a planar wiring conductor (13) and/or a via conductor (12) formed on or in the surface of a ceramic base (11). The resistive element (14) is composed of an Ag-Pd material having a low resistance, while the planar wiring conductor (13) and the via conductor (12) are composed of an Ag material. The resistive element (14) is not in direct contact with the planar wiring conductor (13) and/or the via conductor (12) in a joined portion (15), but is electrically connected therewith via a junction conductor (16).