发明名称 |
Semiconductor device fabrication method |
摘要 |
A semiconductor device fabrication method is disclosed to reliably separate diced semiconductor chips from a dicing tape without damaging the diced semiconductor chip. The method includes the steps of: attaching a wafer on a dicing tape; dicing the wafer, thereby forming divided semiconductor chips; and separating the semiconductor chips from the dicing tape, wherein the step of separating includes the steps of: providing a hollow sheet having at least one aperture corresponding to the semiconductor chips between the semiconductor chips attached on the dicing tape and a porous plate coupled to a vacuum source; sucking the semiconductor chips to the porous plate via the hollow sheet by driving the vacuum source; and separating the dicing tape from the semiconductor chips under a condition where the semiconductor chips are being sucked to the porous plate.
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申请公布号 |
US2004175903(A1) |
申请公布日期 |
2004.09.09 |
申请号 |
US20040781416 |
申请日期 |
2004.02.18 |
申请人 |
SUNOHARA MASAHIRO;MURAYAMA KEI |
发明人 |
SUNOHARA MASAHIRO;MURAYAMA KEI |
分类号 |
H01L21/00;H01L21/301;H01L21/68;H01L21/78;(IPC1-7):H01L21/66 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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