发明名称 LASER BEAM MACHINING METHOD, LASER BEAM MACHINING DEVICE, LASER BEAM MACHINING PROGRAM AND RECORDING MEDIUM THAT RECORDS LASER BEAM MACHINING PROGRAM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method and a laser beam machining device capable of improving operating efficiency and machining accuracy. <P>SOLUTION: In the laser beam machining method, machining is performed by sequentially irradiating laser beam on all the machining points in objects for machining. The method includes a dividing step to divide a domain including all the machining points into at least one or more domains including a plurality of machining points, a position obtaining step to obtain positions of the plurality of machining points, a machining point and machining order selecting step to select machining orders from the data of positions obtained in the position obtaining step. After all the machining points within one domain divided in the dividing step are machined, machining in the next domain is executed to improve operating efficiency and machining accuracy. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p>
申请公布号 JP2004249297(A) 申请公布日期 2004.09.09
申请号 JP20030039732 申请日期 2003.02.18
申请人 SUMITOMO HEAVY IND LTD 发明人 HIRATANI SHINICHI
分类号 B23K26/00;B23K101/40;(IPC1-7):B23K26/00 主分类号 B23K26/00
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