METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer ceramic substrate in which dimensional accuracy between conductor patterns is improved. SOLUTION: Since the planar firing shrinkage of the multilayer ceramic substrate can be prevented by enhancing the firing shrinkage of the substrate in the thickness direction, by heat- and press-bonding a multilayer green ceramic sheet 13 to a ceramic substrate 14 through an adhesive layer 15, and stress-baking a porous ceramic setter 16 by disposing the setter 16 on another multilayer green ceramic sheet 13 through a mold-released layer 17, the dimensional accuracy between conductor patterns in the in-plane direction and the dimensional accuracy of the multilayer ceramic substrate can be improved. COPYRIGHT: (C)2004,JPO&NCIPI