| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant and heat-conductive material almost free from the attachment of a fine powder such as dust or toner and excellent in heat-dissipating properties. SOLUTION: The heat-resistant and heat-conductive material comprises an organic or inorganic hybrid material obtained by subjecting, to heat gelation, a sol solution containing a metal or metalloid alkoxide, an organosilicon compound, and a highly heat-conductive material. The hybrid material is excellent in mold releasability and almost free from the attachment of dust, toner or the like, and facilitates the removal even if such attachment occurs. The highly heat-conductive material imparts good heat-dissipating properties to the hybrid material. COPYRIGHT: (C)2004,JPO&NCIPI
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