发明名称 |
Method of obtaining a self-supported thin semiconductor layer for electronic circuits |
摘要 |
The invention relates to a method of producing a self-supported thin layer of a semiconductor material supporting at least one electronic component or circuit or both on one of its faces, from a wafer of the material by thinning of the wafer. The wafer has a front face supporting or for supporting at least one electronic component or circuit and a rear face. The method is remarkable in that it includes: a) implanting atomic species in the interior of the wafer through its rear face to obtain a zone of weakness defining a front portion extending from the front face of the zone of weakness and a rear portion formed by the remainder of the wafer; b) detaching the rear portion from the front portion; and c) if necessary, repeating steps a) and b) on the rear face of the front portion until the front portion has the desired thickness for constituting the self-supported thin layer. |
申请公布号 |
US2004175902(A1) |
申请公布日期 |
2004.09.09 |
申请号 |
US20040775917 |
申请日期 |
2004.02.09 |
申请人 |
RAYSSAC OLIVIER;MAZURE CARLOS;GHYSELEN BRUNO |
发明人 |
RAYSSAC OLIVIER;MAZURE CARLOS;GHYSELEN BRUNO |
分类号 |
H01L21/304;H01L21/762;(IPC1-7):H01L21/30;H01L21/46 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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