| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of a stack LSI configuration obtained by stacking a plurality of semiconductor chips of an identical size in one package, wherein a clearance between the semiconductor chips stacked is ensured without using a spacer, etc. SOLUTION: In the semiconductor device, the first semiconductor chip 20 of a lowermost stage is secured to the upper surface of an interposer substrate 10 for stacking and mounting the semiconductor chips through adhesives 70, and a projection obtained by stacking ball bumps 21, 22, respectively, is formed on a plurality of electrode pads 23 provided on an upper surface of the first semiconductor chip 20. The second semiconductor chip 30 of a second stage is mounted on the first semiconductor chip 20 via this projection, whereby a clearance t between the first and second semiconductor chips is ensured, and also the second semiconductor chip 30 is secured to the first semiconductor chip 20 through adhesives 71. COPYRIGHT: (C)2004,JPO&NCIPI
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