| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer substrate which can prevent the occurrence of cracks, and also to provide a method of manufacturing the same. <P>SOLUTION: The multilayer substrate 1 has a single-sided conductor pattern film 20 located in a surface layer. The single-sided conductor pattern film 20 has such a structure that a conductor pattern including a land 3 is formed on one face of a resin film 2 formed of thermoplastic resin, and a via hole 5 with the land 3 as a bottom face is filled with an interlayer connection material 4. In a part of the front surface or rear surface of the land 3, a concave portion 7 is formed. In the multilayer substrate 1, when the resin film 2 shrinks, the land 3 can also be deformed in compliance with the shrinkage of the resin film 2, resulting in preventing the occurrence of cracks 6 in the resin film 2 in contact with the land 3. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
