发明名称 HEAT WELDING MACHINE
摘要 PROBLEM TO BE SOLVED: To provide heat welding machine which can improve the manufacturing efficiency by properly adjusting the pressure applied to each electronic component to press and mount a plurality of electronic components simultaneously, and which unifies the pressure received by the electronic components or properly adjusts the pressure received by each electronic component and thereby mounts the electronic components simultaneously on a wiring board. SOLUTION: The heat welding machine has a pressing section for simultaneously pressing the plurality of electronic components temporarily mounted on the mounting section of the wiring board and a heating section for heating the pressing section, and which presses the electronic components against the wiring board while heating them by means of the pressing section heated by the heating section; a supporting member which has a supporting face for supporting the wiring board whereon the electronic components are temporarily mounted, from under the mounting section of the wiring board, with the supporting face opposite to the pressing section of the heat welding head; and an adjustment mechanism which has an energizing member for energizing the supporting member towards the heat welding head and an adjustment member for adjusting the energizing force of the energizing member, and which adjusts the pressure received by each of the electronic components. The heat welding machine controls the pressure received by each electronic component by adjusting the supporting force of the supporting member by means of the energizing member, and simultaneously welds the electronic components. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004253563(A) 申请公布日期 2004.09.09
申请号 JP20030041524 申请日期 2003.02.19
申请人 SONY CORP 发明人 KAWABE HIDEO;UEDA MITSUNORI;KOTAKE RYOTA
分类号 H05K3/32;H01L21/60;H01L21/603;(IPC1-7):H05K3/32 主分类号 H05K3/32
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