发明名称 DESIGN APPARATUS FOR MULTILAYER WIRED BOARD, ITS DESIGN METHOD AND RECORDING MEDIUM
摘要 PROBLEM TO BE SOLVED: To make it possible to design a current feedback route just under or above a signal layer when designing a multilayer wired board and to design a printed board or the like for sharply reducing electromagnetic radiation noise. SOLUTION: A design apparatus for a multilayer wired board is provided with a monitor having a display screen for designing a four-layer wired board and capable of plotting a transmitting IC and a receiving IC, an input tool 22 for specifying a signal wire for connecting between the transmitting IC and the receiving IC on a signal layer plotted on the monitor 21 and a control means 23 for projecting the signal layer specified by the input tool 22 to a power supply layer and a ground layer of the four-layer wired board plotted on the monitor 21, setting a specific area projected to the power supply layer and the ground layer as a return current pass from the receiving IC to the transmitting IC and setting the return current pass as a wiring inhibition area. Consequently the signal layer and the return current pass can be wired while maintaining the shortest inter-layer distance. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004252743(A) 申请公布日期 2004.09.09
申请号 JP20030042940 申请日期 2003.02.20
申请人 SONY CORP 发明人 TAKEUCHI ISATO;MURAYAMA TOSHIO;MEITOMA TOSHIHIRO
分类号 G06F17/50;H05K3/00;(IPC1-7):G06F17/50 主分类号 G06F17/50
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