发明名称 |
DESIGN APPARATUS FOR MULTILAYER WIRED BOARD, ITS DESIGN METHOD AND RECORDING MEDIUM |
摘要 |
PROBLEM TO BE SOLVED: To make it possible to design a current feedback route just under or above a signal layer when designing a multilayer wired board and to design a printed board or the like for sharply reducing electromagnetic radiation noise. SOLUTION: A design apparatus for a multilayer wired board is provided with a monitor having a display screen for designing a four-layer wired board and capable of plotting a transmitting IC and a receiving IC, an input tool 22 for specifying a signal wire for connecting between the transmitting IC and the receiving IC on a signal layer plotted on the monitor 21 and a control means 23 for projecting the signal layer specified by the input tool 22 to a power supply layer and a ground layer of the four-layer wired board plotted on the monitor 21, setting a specific area projected to the power supply layer and the ground layer as a return current pass from the receiving IC to the transmitting IC and setting the return current pass as a wiring inhibition area. Consequently the signal layer and the return current pass can be wired while maintaining the shortest inter-layer distance. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004252743(A) |
申请公布日期 |
2004.09.09 |
申请号 |
JP20030042940 |
申请日期 |
2003.02.20 |
申请人 |
SONY CORP |
发明人 |
TAKEUCHI ISATO;MURAYAMA TOSHIO;MEITOMA TOSHIHIRO |
分类号 |
G06F17/50;H05K3/00;(IPC1-7):G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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