| 摘要 |
A rigid pellicle, used to protect a patterned reticle from contamination in a lithographic process in the manufacture of integrated circuits, is attached to a mounting frame by fusing the pellicle and frame together. In one embodiment, an infrared laser beam is used to produce the fusion along the seam between the pellicle and the frame. The frame may also be attached to the reticle through a similar fusion process. In one embodiment, the pellicle, frame, and reticle are all comprised of fused silica.
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