发明名称 CUTTING METHOD OF WORKPIECE AND WORKPIECE
摘要 PROBLEM TO BE SOLVED: To efficiently improve luminance of a light conductive plate by efficiently improving transmissivity of the light of the microlens array type light conductive plate 11 having a required plurality of microlenses. SOLUTION: The microlenses of the light conductive plate 1 are formed as a mirror surface by removing a part between a contour line 34 of a transparent raw material 31 and the light conductive plate 11 by elliptically vibrating and cutting the required-shaped transparent raw material 31 such as an acrylic plate by a cutting tool 32. That is, first of all, the transparent raw material 31 is cut in the main component force direction B by the cutting tool 32, and the cutting tool 3 is separated in the back component force direction D from a machined material 1, and next, chips 5 cut from the transparent raw material 31 are pulled up in the back component force direction D by an edge of the cutting tool 32, and the chips 5 are made to flow out in the chip flowing-out direction E, and the microlenses of the light conductive plate 11 are formed as the mirror surface. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004249369(A) 申请公布日期 2004.09.09
申请号 JP20030039054 申请日期 2003.02.18
申请人 TOWA CORP 发明人 OSADA MICHIO;MATSUO MAKOTO;NAMAKO MASAAKI;AZUMA DAISUKE;HARADA KAZUHIRO
分类号 G02F1/13357;B23B1/00;B23B5/36;B23D5/00;(IPC1-7):B23D5/00;G02F1/133 主分类号 G02F1/13357
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