| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of treating a substrate by which an edge region to be exposed can be exposed with high accuracy during the course of edge exposure. <P>SOLUTION: A substrate treating device measures the thickness of a formed resist film when a resist is applied to a substrate (step S104). The controller of the substrate treating device decides the optimum luminous exposure at the time of exposing the peripheral edge region of the substrate in accordance with the thickness of the resist film (step S106). Then, the edge exposure is performed on the substrate based on the decided luminous exposure (step S109). Consequently, the peripheral edge region to be exposed can be exposed with high accuracy and the contamination etc., of the substrate caused by a peeled resist can be prevented. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
