| 摘要 |
PROBLEM TO BE SOLVED: To prevent crawl-up of an adhesive to a sensor chip, and to prevent thermal expansion of the air in a hollow part under a membrane, in a sensor device of a stuck structure type. SOLUTION: In this sensor device S1 constituted by loading a sensor chip 10 having a recessed part 13 formed on one face 11 side and the membrane 20 formed so as to cover the recessed part 13 on the other face 12 side, on a circuit chip 40 through the adhesive 30 on one face 11 side, an adhesive film is used as the adhesive 30, and the adhesive 30 is arranged so as to form a communicating path 31 for communicating the space in the recessed part 13 with the outside. COPYRIGHT: (C)2004,JPO&NCIPI
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