| 摘要 |
PROBLEM TO BE SOLVED: To enable stable production by bonding an electric flexible cable to a member even when the member has a deflection temperature under load lower than a curing temperature of a thermosetting adhesive in the case where the flexible cable is bonded by the adhesive. SOLUTION: In the case where the electric flexible cable is bonded to a recording head, as a chip plate (alumina) is projected to the side of the electric flexible cable rather than a chip tank (Noryl), a heat-pressure horn is brought into press contact to the chip plate with the electric flexible cable therebetween, but the load is not applied to the chip tank and only the radiant heat is transferred thereto to cure the adhesive, thereby carrying out the bonding without creating the deformation. COPYRIGHT: (C)2004,JPO&NCIPI
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