发明名称 |
Wafer level system for producing burn-in/screen, and reliability evaluations to be performed on all chips simultaneously without any wafer contacting |
摘要 |
A wafer level system for producing burn-in, voltages screen, and reliability evaluations which are to be performed on all wafers simultaneously without necessitating the probe contacting of any wafer during burn-in/stress. Also provided is a method for implementing the wafer level product burn-in/screen, and semiconductor reliability evaluations on semiconductor chips pursuant to the wafer level system. Pursuant to a preferred aspect all chips of a wafer are stressed simultaneously without having a probe physically contact any chip during the stress procedure. This concept can be applied to burn-in of product wafers, voltage screen of product wafers, and reliability evaluations of various failure mechanisms.
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申请公布号 |
US2004175851(A1) |
申请公布日期 |
2004.09.09 |
申请号 |
US20040801387 |
申请日期 |
2004.03.16 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ABADEER WADGI W.;MOTSIFF WILLIAM T.;NOWAK EDWARD J. |
分类号 |
G01R1/04;G01R31/28;G01R31/315;(IPC1-7):H01L21/66 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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