Apparatus for removing an adhesive film on a chip

摘要

An apparatus for removing an adhesive film on a chip that has been cut. The adhesive film is adhered to a bottom surface of the chip. The apparatus includes a sucker, a push-up needle device, and a vacuum chamber. The sucker is arranged above the chip with the adhesive film to suck the chip. The push-up needle device is arranged under the bottom surface of the chip and has a slim support surface to support the adhesive film on the bottom surface of the chip. The vacuum chamber is arranged below the bottom surface of the chip to suck the adhesive film downward and separate the adhesive film from the chip. Accordingly, it is possible to prevent the chip 38 from being broken or cracked owing to the uneven force.