发明名称 |
Polyamic acid resin composition |
摘要 |
Provided is a polyamic acid resin composition for formation of a bank, which provides excellent film characteristics and adhesion to a substrate, which can undergo patterning with use of a positive type photoresist, and which can be transformed into a polyimide after the patterning to yield a polyimide resin with upper part of film having a low surface energy. It is achieved by a polyamic acid resin composition comprising a polyamic acid [a] as a base and a polyamic acid [b] having a fluorine-containing alkyl group with a carbon number of at least 2, and containing the polyamic acid [b] in an amount of from 0.1 to 30 wt % to the total amount of the polyamic acid [a] and the polyamic acid [b]. |
申请公布号 |
US2004175646(A1) |
申请公布日期 |
2004.09.09 |
申请号 |
US20040484719 |
申请日期 |
2004.01.26 |
申请人 |
HATANAKA TADASHI;ANTONIO SAHADE DANIEL;NIHIRA TAKAYASU |
发明人 |
HATANAKA TADASHI;ANTONIO SAHADE DANIEL;NIHIRA TAKAYASU |
分类号 |
C08G73/10;C08L79/08;G03F7/004;G03F7/023;G03F7/037;G03F7/038;G03F7/075;(IPC1-7):G03F7/00;G03F7/30 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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