| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid-cooled power semiconductor module having a sealing part structure for effectively preventing the leakage of a cooling liquid. <P>SOLUTION: In the liquid-cooled power semiconductor module, a liquid leakage inhibitor is filled in the contact part of the base of the semiconductor module with the first member of a liquid cooling member, and the base is sandwiched between the first member and the second member of a pressing member. The liquid leakage inhibitor is preferably a liquid-like or clay-like liquid leakage inhibitor which is cured after filling. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
