| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaging machine for an electronic component which can remarkably improve the packaging throughput of an electronic component to a printed circuit board while completely eliminating the possibility of collisions among head units. <P>SOLUTION: In the packaging machine of an electronic component, electronic component movable regions A, B, C, D are arranged independently so as not to be overlapped with each other in a plurality of head units 3. A substrate holding means 4 moves printed circuit boards 1 sequentially to the respective packaging parts 8 of the plurality of head units 3. The substrate holding means 4 can mount electronic components held with the head units 3 which are in a still state in the packaging parts 8 on packaging positions of the printed circuit boards 1 by further moving them. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
